rs3a thru rs3k vishay semiconductors formerly general semiconductor document number 88709 www.vishay.com 11-feb-02 1 surface mount fast switching rectifier reverse voltage 50 to 800v forward current 3.0a maximum ratings & thermal characteristics ratings at 25? ambient temperature unless otherwise specified. parameters symbols rs3a rs3b rs3d RS3G rs3j rs3k units device marking code ra rb rd rg rj rk maximum repetitive peak reverse voltage v rrm 50 100 200 400 600 800 v maximum rms voltage v rms 35 70 140 280 420 500 v maximum dc blocking voltage v dc 50 100 200 400 600 800 v maximum average forward rectified current at t l =75? i f(av) 3.0 a peak forward surge current 8.3ms single half sine-wave superimposed on i fsm 100 a rated load (jedec method) t l =75? typical thermal resistance (1) r ja 50 r jl 15 ?/w operating junction and storage temperature range t j , t stg -55 to +150 ? electrical characteristics ratings at 25? ambient temperature unless otherwise specified. maximum instantaneous forward voltage at 2.5a v f 1.3 v maximum dc reverse current t a =25? 10 at rated dc blocking voltage t a =125? i r 250 a maximum reverse recovery time i f =0.5a, i r =1.0a, i rr =0.25a t rr 150 250 500 ns typical junction capacitance at 4.0v, 1mhz c j 60 pf notes: (1) thermal resistance from junction to ambient and from junction to lead mounted on p.c.b. with 0.3 x 0.3 (8.0 x 8.0mm) copper pad area dimensions in inches and (millimeters) features ?plastic package has underwriters laboratory flammability classification 94v-0 ?low profile surface mount package ?built-in strain relief ?fast switching for high efficiency ?easy pick and place ?glass passivated chip junction high temperature soldering: 250?/10 seconds at terminals mechanical data case: jedec do-214ab molded plastic over glass passivated chip terminals: solder plated, solderable per mil-std-750, method 2026 polarity: color band denotes cathode end weight: 0.007 oz., 0.25 g packaging codes/options: 9/3.5k per 13" reel (16mm tape) 7/850 ea per 7" reel (16mm tape) 0.280 (7.11) 0.260 (6.60) 0.012 (0.305) 0.006 (0.152) 0.008 (0.203) max. 0.320 (8.13) 0.305 (7.75) 0.060 (1.52) 0.030 (0.76) 0.245 (6.22) 0.220 (5.59) 0.126 (3.20) 0.114 (2.90) 0.103 (2.62) 0.079 (2.06) cathode band do-214ab (smc) 0.185 max. (4.69 max.) 0.121 min. (3.07 min.) 0.060 min. (1.52 min.) 0.320 ref mounting pad layout
rs3a thru rs3k vishay semiconductors formerly general semiconductor www.vishay.com document number 88709 2 11-feb-02 lead temperature ( c) fig. 1 ? forward current derating curve average forward current (a) fig. 3 ? typical instantaneous forward characteristics instantaneous forward voltage (v) instantaneous forward current (a) percent of rated peak reverse voltage (%) instantaneous reverse current ( a) fig. 4 ? typical reverse characteristics number of cycles at 60 h z fig. 2 ? maximum non-repetitive peak forward surge current peak forward surge current (a) t, pulse duration, sec transient thermal impedance ( cw) fig. 5 ? typical transient thermal impedance 0 50 100 150 200 0 1.0 2.0 2.5 3.0 p.c.b. mounted 0.3 x 0.3" (8.0 x 8.0 mm) copper pad areas resistive or inductive load 1 10 100 0 25 50 75 100 125 150 t l = 75 c 8.3ms single half sine-wave (jedec method) 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.1 1 10 100 pulse width = 300 s 1% duty cycle 0 20 40 60 80 100 0.01 0.1 1 10 100 0.01 0.1 1 10 100 0.1 1 10 100 mounted on 0.20 x 0.27" (5 x 7 mm) copper pad areas t j = 25 c t j = 125 c t j = 25 c t j = 40 c t j = 125 c t j = 75 c ratings and characteristic curves (t a = 25 c unless otherwise noted)
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